Lockheed Martin Corporation
METHOD FOR THERMALLY CORRECTING DATA OBTAINED THROUGH STRAIN GAUGES MOUNTED TO A SURFACE

Abstract:

An instrumentation system for use with a component formed from a first material having non-uniform coefficients of thermal expansion includes a first sensing system configured to be mounted to the component to sense temperature and mechanical forces on the component, and a thermally compensating coupon configured to be mounted to the component adjacent the first sensing system. The thermally compensating coupon is formed from a second material having non-uniform coefficients of thermal expansion that are substantially identical to the non-uniform coefficients of thermal expansion of the first material. A thermally compensating sensing system is mounted to the thermally compensating coupon and connected to the first sensing system. The thermally compensating sensing system is isolated from mechanical forces perceived by the component while sensing temperatures on the component such that the connection of the thermally compensating sensing system to compensate for the temperature sensed by the first sensing system.