Lockheed Martin Corporation
Multi-lenslet PIC imagers and packaging configurations
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Abstract:
A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.
Status:
Grant
Type:
Utility
Filling date:
27 Feb 2019
Issue date:
15 Jun 2021