Lockheed Martin Corporation
Nanoparticle application with adhesives for printable electronics

Abstract:

A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal.