Lockheed Martin Corporation
Method and apparatus for low-profile fiber-coupling to photonic chips

Abstract:

Apparatus and method for clamping optical fibers to a photonic chip. Some embodiments include a transparent second plate; a grooved first plate; and a plurality of optical fibers held between the first plate and the second plate, wherein each optical fiber has a core, a cladding layer, and an end facet that reflects light from the core through a first region of the cladding layer and out of the respective optical fiber and through the transparent second plate. The first region has a higher index of refraction than the first cladding layer surrounding the first region. Some embodiments include a method for making the apparatus. Some embodiments include a method for using the apparatus.