Applied Optoelectronics, Inc.
Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same

Last updated:

Abstract:

The present disclosure is generally directed to a stepped profile for substrates that support "on board" optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.

Status:
Grant
Type:

Utility

Filling date:

8 Jan 2020

Issue date:

16 Nov 2021