Applied Optoelectronics, Inc.
TECHNIQUES FOR ELECTRICALLY ISOLATING N AND P-SIDE REGIONS OF A SEMICONDUCTOR LASER CHIP FOR P-SIDE DOWN BONDING

Abstract:

In general, a MQW semiconductor laser chip with an electrically insulated P-side region and a process for forming the same is disclosed. The MQW semiconductor laser chip, also referred to herein as a MQW semiconductor laser or simply a semiconductor laser, includes a layer of electrically insulative material that extends along at least a portion of the sidewalls to minimize or otherwise reduce the potential for electrical shorts between P and N-sides of the same when utilizing P-side bonding techniques.