Analog Devices, Inc.
LOW STRESS INTEGRATED DEVICE PACKAGE
Last updated:
Abstract:
An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.
Status:
Application
Type:
Utility
Filling date:
4 Dec 2020
Issue date:
9 Jun 2022