Analog Devices, Inc.
LOW STRESS INTEGRATED DEVICE PACKAGE

Last updated:

Abstract:

An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

Status:
Application
Type:

Utility

Filling date:

4 Dec 2020

Issue date:

9 Jun 2022