Applied Materials, Inc.
Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods

Abstract:

A temperature-controllable process chamber configured to process substrates may include one or more vertical walls at least partially defining a chamber portion of the process chamber. Multiple zones may be located about a periphery of the one or more vertical walls and multiple temperature control devices are thermally coupled to the periphery of the one or more vertical walls in each of the multiple zones. A controller coupled to the temperature control devices may be configured to individually control temperatures of the multiple temperature control devices to obtain substantial temperature uniformity across a substrate located in the chamber portion. Other systems and methods of manufacturing substrates are disclosed.