Applied Materials, Inc.
Electrostatic chuck for high temperature processing chamber

Abstract:

Implementations of the present disclosure include methods and apparatuses utilized to reduce cracking of the substrate support surface of a high temperature electrostatic chuck within a processing chamber. In one implementation, a high temperature electrostatic chuck has a ceramic body. The ceramic body has a workpiece mounting surface and a bottom surface. A plurality of backside gas channels are formed in the workpiece mounting surface. A chucking mesh disposed in the ceramic body has a main chucking portion spaced a first distance from the workpiece mounting surface and an electrode mounting portion spaced a second distance from the workpiece mounting surface, wherein the second distance is greater than the first distance. An electrode is coupled the electrode mounting portion and is accessible from the bottom surface.