Applied Materials, Inc.
Unified material-to-systems simulation, design, and verification for semiconductor design and manufacturing

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Abstract:

A complete, unified material-to-systems simulation, design, and verification method for semiconductor design and manufacturing may include evaluating effects of semiconductor material or process changes on software algorithms. The method may include translating the material or process change into a database of characteristics; generating primitive circuit structures using the database of characteristics; performing an electrical characterization of the primitive circuit structures; providing an output of the electrical characterization to a script to generate compact models; generating a lite version of standard cells; generating a digital system based on the lite version of the standard cells; and evaluating a performance of a software algorithm on the digital system to determine an effect of the material or process change for the semiconductor manufacturing process.

Status:
Grant
Type:

Utility

Filling date:

4 Feb 2020

Issue date:

21 Sep 2021