Applied Materials, Inc.
Wafer out of pocket detection

Last updated:

Abstract:

Apparatus and methods to process one or more substrate are described. A processing chamber comprises a support assembly, a chamber lid, and a controller. The chamber lid has a front surface facing the support assembly, a first sensor on the front surface and a second sensor on the front surface, the first sensor positioned at a first distance from the central rotational axis, and the second sensor positioned at a second distance from the central rotational axis greater than the first distance. The controller is configured to determine if a substrate is within or outside of the substrate support region of the support assembly.

Status:
Grant
Type:

Utility

Filling date:

18 May 2020

Issue date:

28 Sep 2021