Applied Materials, Inc.
TEMPERATURE SENSOR FOR END POINT DETECTION DURING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION CHAMBER CLEAN

Abstract:

Embodiments described herein generally relate to a substrate processing chamber, and more specifically to an apparatus and method for monitoring a cleaning processing for the substrate processing chamber. A processor receives one or more temperature readings from one or more sensors disposed in a substrate processing chamber. The processor determines a peak for each temperature reading from the one or more temperature readings, which indicate an end of exothermic film clean reaction. Upon determining that each temperature reading has peaked, the process issues a notification to cease the cleaning process.