Applied Materials, Inc.
DEPOSITION OF METAL FILMS

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Abstract:

Methods for selectively depositing on surfaces are disclosed. Some embodiments of the disclosure utilize an organometallic precursor that is substantially free of halogen and substantially free of oxygen. Deposition is performed to selectively deposit a metal film on a non-metallic surface over a metallic surface. Some embodiments of the disclosure relate to methods of gap filling.

Status:
Application
Type:

Utility

Filling date:

14 Apr 2020

Issue date:

14 Oct 2021