Applied Materials, Inc.
STACK FOR 3D-NAND MEMORY CELL

Last updated:

Abstract:

Memory devices and methods of manufacturing memory devices are provided. A plasma enhanced chemical vapor deposition (PECVD) method to form a memory cell film stack having more than 50 layers as an alternative for 3D-NAND cells is described. The memory stack comprises alternating layers of a first material layer and a second material layer.

Status:
Application
Type:

Utility

Filling date:

6 Apr 2021

Issue date:

21 Oct 2021