Applied Materials, Inc.
IN-SITU APPARATUS FOR SEMICONDUCTOR PROCESS MODULE
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Abstract:
Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.
Status:
Application
Type:
Utility
Filling date:
1 Jul 2021
Issue date:
11 Nov 2021