Applied Materials, Inc.
HEATER COVER PLATE FOR UNIFORMITY IMPROVEMENT

Abstract:

Embodiments of the present disclosure generally relate to an apparatus for improving the film thickness a substrate when using a heated substrate support. A cover plate to be placed over the top surface of a heated substrate support is disclosed. The cover plate includes a pocket formed in the middle thereof for the placement of a substrate. The cover plate may include a variety of features including a plurality of dimples, a plurality of radially disposed grooves, a plurality of annular grooves, lift pin holes, pin slots, and gas exhaust holes.