Applied Materials, Inc.
SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SUBSTRATES USING PHOTO-ILLUMINATION

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Abstract:

A method may include providing a substrate in a process chamber, directing radiation from an illumination source to the substrate when the substrate is disposed in the process chamber, and processing the substrate by providing a processing species to the substrate, separate from the radiation, when the substrate is disposed in the process chamber. As such, the radiation may be characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.

Status:
Application
Type:

Utility

Filling date:

21 May 2020

Issue date:

25 Nov 2021