Applied Materials, Inc.
Methods of depositing low-K films

Abstract:

Methods for atomic layer deposition (ALD) of plasma enhanced atomic layer deposition (PEALD) of low-.kappa. films are described. A method of depositing a film comprises exposing a substrate to a silicon precursor having the general formula (I) or general formula (II) ##STR00001## wherein X is silicon (Si) or carbon (C), Y is carbon (C) or oxygen (O), R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, and R.sup.8 are independently selected from hydrogen (H), substituted or unsubstituted alkyl alkyl, substituted or unsubstituted alkoxy, substituted or unsubstituted vinyl, silane, substituted or unsubstituted amine, or halide; purging the processing chamber of the silicon precursor; exposing the substrate to an oxidant; and purging the processing chamber of the oxidant.