Applied Materials, Inc.
Predictive modeling of metrology in semiconductor processes
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Abstract:
Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving data from one or more manufacturing tools about a manufacturing process of a silicon wafer. The method further includes determining, based on the data, predictive information about a quality of the silicon wafer. The method further includes providing the predictive information to a manufacturing system, wherein the predictive information is used to determine whether to take corrective action.
Status:
Grant
Type:
Utility
Filling date:
3 Oct 2018
Issue date:
30 Nov 2021