Applied Materials, Inc.
Predictive modeling of metrology in semiconductor processes

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Abstract:

Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving data from one or more manufacturing tools about a manufacturing process of a silicon wafer. The method further includes determining, based on the data, predictive information about a quality of the silicon wafer. The method further includes providing the predictive information to a manufacturing system, wherein the predictive information is used to determine whether to take corrective action.

Status:
Grant
Type:

Utility

Filling date:

3 Oct 2018

Issue date:

30 Nov 2021