Applied Materials, Inc.
Fluorine-Free Tungsten ALD And Tungsten Selective CVD For Dielectrics

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Abstract:

Methods of forming metallic tungsten films selectively on a conductive surface relative to a dielectric surface are described. A substrate is exposed to a first process condition to deposit a fluorine-free metallic tungsten film. The fluorine-free metallic tungsten film is exposed to a second process condition to deposit a tungsten film on the fluorine-free metallic tungsten film.

Status:
Application
Type:

Utility

Filling date:

8 Apr 2021

Issue date:

9 Dec 2021