Applied Materials, Inc.
HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI-ENVIRONMENTS
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Abstract:
A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
Status:
Application
Type:
Utility
Filling date:
1 Jun 2020
Issue date:
2 Dec 2021