Applied Materials, Inc.
THIN LAYER DEPOSITION WITH PLASMA PULSING
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Abstract:
Methods of depositing thin films for an electronic device, for example a semiconductor device include applying a first pulsed plasma with or without a reactant and a second continuous plasma with a reactant.
Status:
Application
Type:
Utility
Filling date:
10 Jun 2021
Issue date:
16 Dec 2021