Applied Materials, Inc.
THIN LAYER DEPOSITION WITH PLASMA PULSING

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Abstract:

Methods of depositing thin films for an electronic device, for example a semiconductor device include applying a first pulsed plasma with or without a reactant and a second continuous plasma with a reactant.

Status:
Application
Type:

Utility

Filling date:

10 Jun 2021

Issue date:

16 Dec 2021