Applied Materials, Inc.
METHOD FOR AUTOMATED CRITICAL DIMENSION MEASUREMENT ON A SUBSTRATE FOR DISPLAY MANUFACTURING, METHOD OF INSPECTING A LARGE AREA SUBSTRATE FOR DISPLAY MANUFACTURING, APPARATUS FOR INSPECTING A LARGE AREA SUBSTRATE FOR DISPLAY MANUFACTURING AND METHOD OF OPERATING THEREOF

Abstract:

According to an embodiment, a method for automated critical dimension measurement on a substrate for display manufacturing is provided. The method includes scanning a first field of view having a first size with a charged particle beam to obtain a first image having a first resolution of a first portion of the substrate for display manufacturing; determining a pattern within the first image, the pattern having a first position; scanning a second field of view with the charged particle beam to obtain a second image of a second portion of the substrate, the second field of view has a second size smaller than the first size and has a second position provided relative to the first position, the second image has a second resolution higher than the first resolution; and determining a critical dimension of a structure provided on the substrate from the second image.