Applied Materials, Inc.
Plasma chamber target for reducing defects in workpiece during dielectric sputtering

Abstract:

Methods and apparatus for plasma chamber target for reducing defects in workpiece during dielectric sputtering are provided. For example, a dielectric sputter deposition target can comprise a dielectric compound having a predefined average grain size ranging from approximately 65 .mu.m to 500 .mu.m, wherein the dielectric compound is at least one of magnesium oxide or aluminum oxide.