Applied Materials, Inc.
SPOT HEATING BY MOVING A BEAM WITH HORIZONTAL ROTARY MOTION
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Abstract:
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.
Status:
Application
Type:
Utility
Filling date:
8 Jul 2020
Issue date:
13 Jan 2022