Applied Materials, Inc.
VAPOR PHASE THERMAL ETCH SOLUTIONS FOR METAL OXO PHOTORESISTS

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Abstract:

Embodiments disclosed herein include methods of developing a metal oxo photoresist. In an embodiment, the method comprises providing a substrate with the metal oxo photoresist into a vacuum chamber, where the metal oxo photoresist comprises exposed regions and unexposed regions. In an embodiment, the unexposed regions comprise a higher carbon concentration than the exposed regions. The method may further comprise vaporizing a halogenating agent into the vacuum chamber, where the halogenating agent reacts with either the unexposed regions or the exposed regions to produce a volatile byproduct. In an embodiment, the method may further comprise purging the vacuum chamber.

Status:
Application
Type:

Utility

Filling date:

15 Jun 2021

Issue date:

6 Jan 2022