Applied Materials, Inc.
Batch heating and cooling chamber or loadlock
Last updated:
Abstract:
Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.
Status:
Grant
Type:
Utility
Filling date:
1 May 2019
Issue date:
26 Apr 2022