Applied Materials, Inc.
Batch heating and cooling chamber or loadlock

Last updated:

Abstract:

Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

Status:
Grant
Type:

Utility

Filling date:

1 May 2019

Issue date:

26 Apr 2022