Applied Materials, Inc.
SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS
Last updated:
Abstract:
Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.
Status:
Application
Type:
Utility
Filling date:
5 Oct 2020
Issue date:
7 Apr 2022