Applied Materials, Inc.
SEMICONDUCTOR SUBSTRATE SUPPORT LEVELING APPARATUS

Last updated:

Abstract:

Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

Status:
Application
Type:

Utility

Filling date:

5 Oct 2020

Issue date:

7 Apr 2022