Applied Materials, Inc.
Chamber conditioning and removal processes
Last updated:
Abstract:
Exemplary methods for conditioning a processing region of a semiconductor processing chamber may include forming conditioning plasma effluents of an oxygen-containing precursor in a semiconductor processing chamber. The methods may include contacting interior surfaces of the semiconductor processing chamber bordering a substrate processing region with the conditioning plasma effluents. The methods may also include treating the interior surfaces of the semiconductor processing chamber.
Status:
Grant
Type:
Utility
Filling date:
22 Dec 2017
Issue date:
10 May 2022