Applied Materials, Inc.
Atomic layer deposition of protective coatings for semiconductor process chamber components

Abstract:

A multi-component coating composition for a surface of a semiconductor process chamber component comprising at least one first film layer of a yttrium oxide or a yttrium fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process and at least one second film layer of an additional oxide or an additional fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process, wherein the multi-component coating composition is selected from the group consisting of YO.sub.xF.sub.y, YAl.sub.xO.sub.y, YZr.sub.xO.sub.y and YZr.sub.xAl.sub.yO.sub.z.