Applied Materials, Inc.
Anchoring dies using 3D printing to form reconstructed wafer

Abstract:

A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.