Applied Materials, Inc.
FLOWABLE CHEMICAL VAPOR DEPOSITION OF METAL OXIDES

Last updated:

Abstract:

Exemplary deposition methods may include introducing a vapor of a metal alkoxide into a processing volume of a semiconductor processing chamber. A substrate defining a trench may be housed in the processing volume. The methods may include condensing the vapor into a liquid metal alkoxide within the trench on the substrate. The methods may include forming a plasma external to the processing volume of the semiconductor processing chamber. The methods may include introducing plasma-generated species into the processing volume. The methods may include exposing the liquid metal alkoxide in the trench to the plasma-generated species. The methods may also include forming a metal oxide film in the trench through a reaction between the liquid metal alkoxide and the plasma-generated species.

Status:
Application
Type:

Utility

Filling date:

1 Nov 2021

Issue date:

5 May 2022