Applied Materials, Inc.
Method and apparatus for measuring wafer movement and placement using vibration data

Abstract:

Embodiments disclose herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the first surface, wherein the sensor regions comprise self-referencing capacitive sensors. In an embodiment, the sensor wafer further comprises a vibration sensor embedded within the substrate.