Applied Materials, Inc.
Decentralized substrate handling and processing system

Abstract:

An electronics manufacturing system includes a first substrate transfer via having position detection sensors to detect a position of a substrate in the first substrate transfer via and flow-controlled valves to inject inert gas through a floor and move the substrate in a predetermined direction with reference to the position within the first substrate transfer via by adjusting a pressure of the inert gas underneath the substrate. A processing chamber is coupled to the first substrate transfer via and having a pedestal with apertures and flow-controlled devices to inject inert gas through the apertures to receive the substrate from the first substrate transfer via and move the substrate into a second substrate transfer via after processing of the substrate.