Applied Materials, Inc.
ION IMPLANTATION TO FORM STEP-OXIDE TRENCH MOSFET

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Abstract:

Disclosed herein are methods for forming MOSFETs. In some embodiments, a method may include providing a device structure including a plurality of trenches, forming a gate spacer layer over the device structure, and removing the gate spacer layer from a top surface of the device structure and from a first section of each of the plurality of trenches, wherein a portion of the gate spacer layer remains along a second section of each of the plurality of trenches. The method may further include forming a gate oxide layer along the first section of each of the plurality of trenches and along the portion of the gate spacer layer.

Status:
Application
Type:

Utility

Filling date:

11 Dec 2020

Issue date:

16 Jun 2022