Applied Materials, Inc.
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE USING IMPROVED SHIELD CONFIGURATIONS

Abstract:

Methods and apparatus for processing a substrate using improved shield configurations are provided herein. For example, a process kit for use in a physical vapor deposition chamber includes a shield comprising an inner wall with an innermost diameter configured to surround a target when disposed in the physical vapor deposition chamber, wherein a ratio of a surface area of the shield to a planar area of the inner diameter is about 3 to about 10.