Applied Materials, Inc.
METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE

Abstract:

A method of depositing a material on a substrate is described. The method includes sputtering at least a component of the material from a first rotary target with a first magnet assembly and a second rotary target with a second magnet assembly. The first magnet assembly within the first rotary target provides a first plasma confinement in a first direction facing towards the second rotary target. The second magnet assembly within the second rotary target provides a second plasma confinement in a second direction facing towards the first rotary target.