Applied Materials, Inc.
Valve for varying flow conductance under vacuum

Last updated:

Abstract:

Embodiments described herein relate to a valve for semiconductor processing. The valve includes a valve body having an inlet conduit and an outlet conduit separated by a diaphragm body. The diaphragm body includes a motor, a transmission link coupled to the motor, a rotatable ring surrounding a fixed plate and separated by a dynamic seal, the rotatable ring coupled to the transmission link, and one or more shutter plates movably coupled to the rotatable ring by a respective pivotable fastener, wherein the fixed plate includes an opening and the one or more shutter plates are movable relative to the opening.

Status:
Grant
Type:

Utility

Filling date:

5 Aug 2020

Issue date:

9 Aug 2022