Applied Materials, Inc.
Low Resistivity Metal Contact Stack
Last updated:
Abstract:
Methods for depositing a metal contact stack on a substrate are described. The method stack includes a metal cap layer and a molybdenum conductor layer. The method includes depositing the metal cap layer on the substrate by physical vapor deposition (PVD) and depositing the molybdenum conductor layer by atomic layer deposition (ALD) on the metal cap layer.
Status:
Application
Type:
Utility
Filling date:
1 Jun 2021
Issue date:
1 Sep 2022