Applied Materials, Inc.
TREATMENTS TO ENHANCE MATERIAL STRUCTURES

Abstract:

A method of forming a high-.kappa. dielectric cap layer on a semiconductor structure formed on a substrate includes depositing the high-.kappa. dielectric cap layer on the semiconductor structure, depositing a sacrificial silicon cap layer on the high-.kappa. dielectric cap layer, performing a post cap anneal process to harden and densify the as-deposited high-.kappa. dielectric cap layer, and removing the sacrificial silicon cap layer.