Applied Materials, Inc.
Reducing Agents for Atomic Layer Deposition
Last updated:
Abstract:
Methods of forming a metal film having a metal halide with a reducing agent are disclosed. The reducing agent, the reducing agent includes a group IV element containing heterocyclic compound, a radical initiator, an alkly alane, a diborene species and/or a Sn(II) compound.
Status:
Application
Type:
Utility
Filling date:
16 Feb 2021
Issue date:
18 Aug 2022