Applied Materials, Inc.
Reducing Agents for Atomic Layer Deposition

Last updated:

Abstract:

Methods of forming a metal film having a metal halide with a reducing agent are disclosed. The reducing agent, the reducing agent includes a group IV element containing heterocyclic compound, a radical initiator, an alkly alane, a diborene species and/or a Sn(II) compound.

Status:
Application
Type:

Utility

Filling date:

16 Feb 2021

Issue date:

18 Aug 2022