Applied Materials, Inc.
ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING

Last updated:

Abstract:

A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

Status:
Application
Type:

Utility

Filling date:

1 Mar 2022

Issue date:

8 Sep 2022