Applied Materials, Inc.
WIRELESS IN-SITU REAL-TIME MEASUREMENT OF ELECTROSTATIC CHUCKING FORCE IN SEMICONDUCTOR WAFER PROCESSING
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Abstract:
Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
Status:
Application
Type:
Utility
Filling date:
25 May 2022
Issue date:
8 Sep 2022