Applied Materials, Inc.
Substrate processing systems, apparatus, and methods with factory interface environmental controls

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Abstract:

Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Status:
Grant
Type:

Utility

Filling date:

24 Aug 2018

Issue date:

20 Sep 2022