Applied Materials, Inc.
Filtering during in-situ monitoring of polishing
Last updated:
Abstract:
A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, filtering a signal from the monitoring system to generate a filtered signal, and determining at least one of a polishing endpoint or an adjustment for a polishing rate from the filtered signal. The filtering includes modelling a plurality of periodic disturbances at a plurality of different frequencies using a plurality of disturbance states, modelling an underlying signal using a plant state, and applying a linear prediction filter to the plant state and the plurality of disturbance states to generate a filtered signal representing the underlying signal.
Status:
Grant
Type:
Utility
Filling date:
6 Mar 2019
Issue date:
20 Sep 2022