Applied Materials, Inc.
Methods and apparatus for forming dual metal interconnects

Abstract:

Methods and apparatus for creating a dual metal interconnect on a substrate. In some embodiments, a first liner of a first nitride material is deposited into at least one 1.times. feature and at least one wider than 1.times. feature, the first liner has a thickness of less than or equal to approximately 12 angstroms; a second liner of a first metal material is deposited into the at least one 1.times. feature and at least one wider than 1.times. feature; the first metal material is reflowed such that the at least one 1.times. feature is filled with the first metal material and the at least one wider than 1.times. feature remains unfilled with the first metal material; a second metal material is deposited on the first metal material, and the second metal material is reflowed such that the at least one wider than 1.times. feature is filled with the second metal material.