Applied Materials, Inc.
Electrostatic puck assembly with metal bonded backing plate for high temperature processes

Abstract:

An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al.sub.2O.sub.3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al.sub.2O.sub.3 and is bonded to the lower puck plate by a second metal bond.