Applied Materials, Inc.
Method for detecting wafer processing parameters with micro resonator array sensors

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Abstract:

Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.

Status:
Grant
Type:

Utility

Filling date:

22 Feb 2019

Issue date:

26 Jan 2021