Applied Materials, Inc.
Apparatus for susceptor temperature verification and methods of use
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Abstract:
Apparatus and methods for processing a semiconductor wafer in which a sensor (e.g., a contact thermocouple) is positioned in the gas distribution assembly measures temperature and/or a film parameter before, during and/or after deposition are described.
Status:
Grant
Type:
Utility
Filling date:
7 Sep 2017
Issue date:
26 Jan 2021