Applied Materials, Inc.
Chattering correction for accurate sensor position determination on wafer

Abstract:

A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values that depend on a thickness of the layer, detecting from the sequence of signal values, a time that the sensor traverses a leading edge of the substrate or a retaining ring and a time that the sensor traverses a trailing edge of the substrate or retaining ring; and for each signal value of at least some of the sequence of signal values, determining a position on the substrate for the signal value based on the time that the sensor traverses the leading edge and the time that the sensor traverses a trailing edge.